SCPS068K July   2001  – September 2024 PCF8574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I2C Interface
      2. 7.3.2 Interface Definition
      3. 7.3.3 Address Reference
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Glossary
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) PCF8574 UNIT
DGV DW N PW RGT RGY
20 PINS 16 PINS 16 PINS 20 PINS 16 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 92 76.7 73.1 94.8 56.0 52.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance - 45.1 51.9 40.2 67.4 50.6 °C/W
RθJB Junction-to-board thermal resistance - 45.8 48.3 58.5 31.2 29.2 °C/W
ψJT Junction-to-top characterization parameter - 17.2 29.8 2.8 3.9 3.3 °C/W
ψJB Junction-to-board characterization parameter - 45.2 47.9 58.0 31.1 29.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - n/a n/a n/a 15.1 16.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.