SCPS121I January   2005  – August 2024 PCF8575

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Switching Characteristics
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I2C Interface
      2. 8.3.2 Interface Definition
      3. 8.3.3 Address Reference
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-On Reset
      2. 9.3.2 System Impact
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) PCF8575 UNIT
DB DBQ DGV DW PW RGE
24 PINS
RθJA Junction-to-ambient thermal resistance 87.8 61 86 75.6 99.7 53.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.9 47.9 42.5 50.8 °C/W
RθJB Junction-to-board thermal resistance 56.8 50.1 66.1 31.5 °C/W
ΨJT Junction-to-top characterization parameter 14.3 21.1 2.7 3.4 °C/W
ΨJB Junction-to-board characterization parameter 56.2 49.7 65.5 31.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 14.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.