SLES254D April 2010 – July 2015 PCM1753-Q1 , PCM1754-Q1
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage | VCC | –0.3 | 6.5 | V |
Ground voltage differences | AGND, DGND | –0.1 | 0.1 | V |
Input voltage | –0.3 | 6.5 | V | |
Input current (any pins except supplies) | –10 | 10 | mA | |
Ambient temperature under bias | –40 | 105 | °C | |
Junction temperature | 150 | °C | ||
Storage temperature, Tstg | –55 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100–002(1) | ±2000 | V | |
Charged device model (CDM), per AEC Q100–011 | Corner pins (1, 8, 9, and 16) | ±750 | |||
Other pins | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VCC | Voltage range | 4.5 | 5 | 5.5 | VDC |
THERMAL METRIC(1) | PCM175x-Q1 | UNIT | |
---|---|---|---|
DBQ (SSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 111.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 55.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 54.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
Resolution | 24 | Bits | |||||
DATA FORMAT | |||||||
fS | Sampling frequency | 5 | 200 | kHz | |||
System clock frequency(3) | 128 fS
192 fS 256 fS 384 fS 512 fS 768 fS 1152 fS |
kHz | |||||
DIGITAL INPUT/OUTPUT | |||||||
Logic family | TTL compatible | ||||||
VIH | Input logic level, high | 2 | VDC | ||||
VIL | Input logic level, low | 0.8 | |||||
IIH | Input logic current, high (SCK, BCK, DATA, and LRCK pins) | VIN = VCC | 10 | µA | |||
IIL | Input logic current, low (SCK, BCK, DATA, and LRCK pins) | VIN = 0 V | –10 | µA | |||
IIH | Input logic current, high (TEST, DEMP, MUTE, and FMT pins) | VIN = VCC | 65 | 100 | µA | ||
IIL | Input logic current, low (TEST, DEMP, MUTE, and FMT pins) | VIN = 0 V | –10 | µA | |||
VOH | Output logic level, high (ZEROA pin) | IOH = –1 mA | 2.4 | VDC | |||
VOL | Output logic level, low (ZEROA pin) | IOL = 1 mA | 0.4 | VDC | |||
DYNAMIC PERFORMANCE(1)(2) | |||||||
THD+N at VOUT = 0 dB | fS = 44.1 kHz | 0.00% | 0.01% | ||||
fS = 96 kHz | 0.00% | ||||||
fS = 192 kHz | 0.00% | ||||||
THD+N at VOUT = -60 dB | fS = 44.1 kHz | 0.65% | |||||
fS = 96 kHz | 0.80% | ||||||
fS = 192 kHz | 0.95% | ||||||
Dynamic range | EIAJ, A-weighted, fS = 44.1 kHz | 100 | 106 | dB | |||
A-weighted, fS = 96 kHz | 104 | ||||||
A-weighted, fS = 192 kHz | 102 | ||||||
Signal-to-noise ratio | EIAJ, A-weighted, fS = 44.1 kHz | 100 | 106 | dB | |||
A-weighted, fS = 96 kHz | 104 | ||||||
A-weighted, fS = 192 kHz | 102 | ||||||
Channel separation | fS = 44.1 kHz | 97 | 103 | dB | |||
fS = 96 kHz | 101 | ||||||
fS = 192 kHz | 100 | ||||||
Level linearity error | VOUT = -90 dB | ±0.5 | dB | ||||
DC ACCURACY | |||||||
Gain error | ±1 | ±6 | % of FSR | ||||
Gain mismatch, channel-to-channel | ±1 | ±3 | % of FSR | ||||
Bipolar zero error | VOUT = 0.5 VCC at BPZ | ±30 | ±60 | mV | |||
ANALOG OUTPUT | |||||||
Output voltage | Full scale (0 dB) | 80% of VCC | VPP | ||||
Center voltage | 50% of VCC | VDC | |||||
Load impedance | AC-coupled load | 5 | kΩ | ||||
DIGITAL FILTER PERFORMANCE | |||||||
FILTER CHARACTERISTICS (SHARP ROLLOFF) | |||||||
Pass band | ±0.04 dB | 0.454 fS | |||||
Stop band | 0.546 fs | ||||||
Pass-band ripple | ±0.04 | dB | |||||
Stop-band attenuation | Stop band = 0.546 fS | –50 | dB | ||||
ANALOG FILTER PERFORMANCE | |||||||
Frequency response | At 20 kHz | –0.03 | dB | ||||
At 44 kHz | –0.20 | ||||||
POWER SUPPLY REQUIREMENTS(2) | |||||||
VCC | Voltage range | 4.5 | 5 | 5.5 | VDC | ||
ICC | Supply current | fS = 44.1 kHz | 16 | 21 | mA | ||
fS = 96 kHz | 25 | ||||||
fS = 192 kHz | 30 | ||||||
Power dissipation | fS = 44.1 kHz | 80 | 105 | mW | |||
fS = 96 kHz | 125 | ||||||
fS = 192 kHz | 150 | ||||||
TEMPERATURE RANGE | |||||||
Operation temperature | –40 | 105 | °C | ||||
RθJA | Thermal resistance | 16-pin SSOP | 115 | °C/W |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
t(SCKH) | System clock pulse duration, high | See Figure 20. | 7 | ns | ||
t(SCKL) | System clock pulse duration, low | 7 | ns | |||
t(SCY) | System clock pulse cycle time | See (1) | ns |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
t(BCY) | BCK pulse cycle time | See Figure 22. | 1/(32 fS) 1/(48 fS) 1/(64 fS)(1) |
ns | |
t(BCH) | BCK high–level time | 35 | ns | ||
t(BCL) | BCK low–level time | 35 | ns | ||
t(BL) | BCK rising edge to LRCK edge | 10 | ns | ||
t(LB) | LRCK falling edge to BCK rising edge | 10 | ns | ||
t(DS) | DATA setup time | 10 | ns | ||
t(DH) | DATA hold time | 10 | ns |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
t(MCY) | MC pulse cycle time | See Figure 1. | 100 | ns | ||
t(MCL) | MC low-level time | 50 | ns | |||
t(MCH) | MC high-level time | 50 | ns | |||
t(MCH) | ML high-level time | See (2) | ns | |||
t(MLS) | ML falling edge to MC rising edge | 20 | ns | |||
t(MLH) | ML hold time(1) | 20 | ns | |||
t(MDH) | MD hold time | 15 | ns | |||
t(MDS) | MD setup time | 20 | ns |
Frequency response | Sharp rolloff |
Frequency response | Slow rolloff |
fS = 32 kHz |
fS = 44.1 kHz |
fS = 48 kHz |
Pass-band ripple | Sharp rolloff |
Transition characteristics | Slow rolloff |
fS = 32 kHz |
fS = 44.1 kHz |
fS = 48 kHz |