SLES092E April 2003 – July 2019 PCM1753 , PCM1754 , PCM1755
PRODUCTION DATA.
THERMAL METRIC(1) | PCM175x | UNIT | |
---|---|---|---|
DBQ (SSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 104.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 53 | °C/W |
RθJB | Junction-to-board thermal resistance | 46.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 46.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |