SLES142B JUNE   2005  – July 2016 PCM1803A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Typical Curves of Internal Filter
        1. 6.6.1.1 Decimation Filter Frequency Response
        2. 6.6.1.2 Low-Cut Filter Frequency Response
      2. 6.6.2 Typical Performance Curves
      3. 6.6.3 Output Spectrum
      4. 6.6.4 Supply Current
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Power-On-Reset Sequence
      3. 7.3.3 System Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Audio Data Interface
        1. 7.4.1.1 Interface Mode
          1. 7.4.1.1.1 Master Mode
          2. 7.4.1.1.2 Slave Mode
        2. 7.4.1.2 Data Format
        3. 7.4.1.3 Interface Timing
      2. 7.4.2 Synchronization With Digital Audio System
      3. 7.4.3 Power Down
      4. 7.4.4 HPF Bypass
      5. 7.4.5 Oversampling Ratio Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Pins
        2. 8.2.2.2 DSP or Audio Processor
        3. 8.2.2.3 Input Filters
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VCC, VDD Pins
      2. 10.1.2 AGND, DGND Pins
      3. 10.1.3 VINL, VINR Pins
      4. 10.1.4 VREF1 Pin
      5. 10.1.5 VREF2 Pin
      6. 10.1.6 DOUT Pin
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

System Two, Audio Precision are trademarks of Audio Precision, Inc.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.