SLES177B April   2006  – August 2015 PCM1808

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 System Clock
      3. 7.3.3 Synchronization With Digital Audio System
      4. 7.3.4 Power On
      5. 7.3.5 Serial Audio Data Interface
        1. 7.3.5.1 Interface Mode
          1. 7.3.5.1.1 Master Mode
          2. 7.3.5.1.2 Slave Mode
        2. 7.3.5.2 Data Format
        3. 7.3.5.3 Interface Timing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fade-In and Fade-Out Functions
      2. 7.4.2 Clock-Halt Power-Down and Reset Function
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Pins
        2. 8.2.2.2 Master Clock
        3. 8.2.2.3 DSP or Audio Processor
        4. 8.2.2.4 Input Filters
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VCC, VDD Pins
      2. 10.1.2 AGND, DGND Pins
      3. 10.1.3 VINL, VINR Pins
      4. 10.1.4 VREF Pin
      5. 10.1.5 DOUT Pin
      6. 10.1.6 System Clock
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

Audio Precision is a trademark of Audio Precision, Inc.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.