SBASAU2 May   2024 PCM1841-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Timing Diagram
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
        3. 6.3.2.3 Left-Justified (LJ) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Input Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Microphone Bias
      7. 6.3.7 Signal-Chain Processing
        1. 6.3.7.1 Digital High-Pass Filter
        2. 6.3.7.2 Configurable Digital Decimation Filters
          1. 6.3.7.2.1 Linear Phase Filters
            1. 6.3.7.2.1.1 Sampling Rate: 8kHz or 7.35kHz
            2. 6.3.7.2.1.2 Sampling Rate: 16kHz or 14.7kHz
            3. 6.3.7.2.1.3 Sampling Rate: 24kHz or 22.05kHz
            4. 6.3.7.2.1.4 Sampling Rate: 32kHz or 29.4kHz
            5. 6.3.7.2.1.5 Sampling Rate: 48kHz or 44.1kHz
            6. 6.3.7.2.1.6 Sampling Rate: 96kHz or 88.2kHz
            7. 6.3.7.2.1.7 Sampling Rate: 192kHz or 176.4kHz
          2. 6.3.7.2.2 Low-Latency Filters
            1. 6.3.7.2.2.1 Sampling Rate: 16kHz or 14.7kHz
            2. 6.3.7.2.2.2 Sampling Rate: 24kHz or 22.05kHz
            3. 6.3.7.2.2.3 Sampling Rate: 32kHz or 29.4kHz
            4. 6.3.7.2.2.4 Sampling Rate: 48kHz or 44.1kHz
            5. 6.3.7.2.2.5 Sampling Rate: 96kHz or 88.2kHz
      8. 6.3.8 Dynamic Range Enhancer (DRE)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Shutdown
      2. 6.4.2 Active Mode
  8. 7Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9Revision History
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) PCM1841-Q1 UNIT
RGE (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 45.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30 °C/W
RθJB Junction-to-board thermal resistance 22.5 °C/W
ψJT Junction-to-top characterization parameter 0.8 °C/W
ψJB Junction-to-board characterization parameter 22.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 15 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.