SBFS036B May   2015  – August 2015 PCM2704C , PCM2705C , PCM2706C

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: PCM2704C, PCM2705C
    5. 7.5  Thermal Information: PCM2706C, PCM2707C
    6. 7.6  Electrical Characteristics: PCM2704CDB, PCM2705CDB, PCM2706CPJT, PCM2707CPJT
    7. 7.7  Audio Interface Timing Characteristics
    8. 7.8  Audio Clock Timing Characteristics
    9. 7.9  External ROM Read Interface Timing Characteristics
    10. 7.10 SPI Timing Characteristics
    11. 7.11 Typical Characteristics
      1. 7.11.1 Internal Filter: DAC Digital Interpolation Filter Frequency Response
      2. 7.11.2 Internal Filter: DAC Analog Low-Pass Filter Frequency Response
      3. 7.11.3 General Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  Clock and Reset
      2. 9.3.2  Operation Mode Selection
        1. 9.3.2.1 Power Configuration Select/Host Detection
        2. 9.3.2.2 Function Select (PCM2706C/7C Only)
      3. 9.3.3  DAC
      4. 9.3.4  Digital Audio Interface: S/PDIF Output
        1. 9.3.4.1 Channel Status Information
        2. 9.3.4.2 Copyright Management
      5. 9.3.5  Digital Audio Interface: I2S Interface Output (PCM2706C/7C)
      6. 9.3.6  Descriptor Data Modification
      7. 9.3.7  External ROM Descriptor (PCM2704C/6C)
      8. 9.3.8  External ROM Example
      9. 9.3.9  Serial Programming Interface (PCM2705C/7C)
      10. 9.3.10 USB Host Interface Sequence
        1. 9.3.10.1 Power-On, Attach, and Playback Sequence
        2. 9.3.10.2 Play, Stop, and Detach Sequence
        3. 9.3.10.3 Suspend and Resume Sequence
      11. 9.3.11 Operating Environment
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 USB Interface
        1. 9.5.1.1 Device Configuration
        2. 9.5.1.2 Interface Number 0 (Default/Control Interface)
        3. 9.5.1.3 Interface Number 1 (Isochronous-Out Interface)
        4. 9.5.1.4 Interface Number 2 (HID Interface)
          1. 9.5.1.4.1 HID Items Reported
            1. 9.5.1.4.1.1 Basic HID Operation
            2. 9.5.1.4.1.2 Extended HID Operation (PCM2705/6/7)
            3. 9.5.1.4.1.3 Auxiliary HID Status Report (PCM2705C/7C)
        5. 9.5.1.5 Endpoints
    6. 9.6 Register Maps
      1. 9.6.1 SPI Register (PCM2705C/7C)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Typical Circuit Connection 1: USB Speaker
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Circuit Connection 2: Remote Headphone
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Typical Circuit Connection 3: DSP Surround Processing Amplifier
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

The decoupling capacitors must be as close as possible to the PCM2704C/5C/6C/7C pins. TI recommends placing an output filter such as the one shown in Detailed Design Procedure. The PCM2704C/5C/6C/7C is a low power device, so there is no need for a special heat sink PCB design.

12.2 Layout Example

PCM2704C PCM2705C PCM2706C PCM2707C Layout_Example_1.gifFigure 38. Layout Example 1
PCM2704C PCM2705C PCM2706C PCM2707C Layout_Example_2.gifFigure 39. Layout Example 2
PCM2704C PCM2705C PCM2706C PCM2707C Layout_Example_3.gifFigure 40. Layout Example 3