SBFS038A June   2012  – September 2015 PCM2903C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
      1. 7.6.1  Typical Characteristics: ADC
      2. 7.6.2  Typical Characteristics: DAC
      3. 7.6.3  Typical Characteristics: ADC Output Spectrum
      4. 7.6.4  Typical Characteristics: DAC Output Spectrum
      5. 7.6.5  Typical Characteristics: Supply Current
      6. 7.6.6  Typical Characteristics: ADC Digital Decimation Filter Frequency Response
      7. 7.6.7  Typical Characteristics: ADC Digital High-Pass Filter Frequency Response
      8. 7.6.8  Typical Characteristics: ADC Analog Antialiasing Filter Frequency Response
      9. 7.6.9  Typical Characteristics: DAC Digital Interpolation Filter Frequency Response
      10. 7.6.10 Typical Characteristics: DAC Analog Fir Filter Frequency Response
      11. 7.6.11 Typical Characteristics: DAC Analog Low-Pass Filter Frequency Response
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 End-Points
      2. 9.3.2 Clock and Reset
      3. 9.3.3 Digital Audio Interface
      4. 9.3.4 Supported Input/Output Data
      5. 9.3.5 Channel Status Information
      6. 9.3.6 Copyright Management
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 USB Interface
      2. 9.5.2 Device Configuration
        1. 9.5.2.1 Interface Number 0
        2. 9.5.2.2 Interface Number 1
        3. 9.5.2.3 Interface Number 2
        4. 9.5.2.4 Interface Number 3
      3. 9.5.3 Interface Sequence
        1. 9.5.3.1 Power On, Attach, and Playback Sequence
        2. 9.5.3.2 Play, Stop, and Detach Sequence
        3. 9.5.3.3 Record Sequence
        4. 9.5.3.4 Suspend and Resume Sequence
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

  • Updated Operating Environments for PCM270X, PCM290X Applications, SLAA374

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

SpAct, E2E are trademarks of Texas Instruments.

System Two, Audio Precision are trademarks of Audio Precision, Inc.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.