SBAS452A September   2008  – January 2016 PCM3168A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Requirements: System Clock
    7. 8.7  Timing Requirements: Power-On Reset
    8. 8.8  Timing Requirements: Audio Interface for Left-Justified, Right-Justified, and I2S (Slave Mode)
    9. 8.9  Timing Requirements: Audio Interface for Left-Justified, Right-Justified, and I2S (Master Mode)
    10. 8.10 Timing Requirements: Audio Interface for DSP and TDM (Slave Mode)
    11. 8.11 Timing Requirements: Audio Interface for DSP and TDM (Master Mode)
    12. 8.12 Timing Requirements: DAC Outputs and ADC Outputs
    13. 8.13 Timing Requirements: Four-Wire Serial Control Interface
    14. 8.14 Timing Requirements: SCL and SDA Control Interface
    15. 8.15 Typical Characteristics
      1. 8.15.1 ADC Digital Filter
      2. 8.15.2 DAC Digital Filter
      3. 8.15.3 ADC Performance
      4. 8.15.4 DAC Performance
      5. 8.15.5 Output Spectrum
      6. 8.15.6 Power-Supply
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Analog Inputs
      2. 9.3.2  Analog Outputs
      3. 9.3.3  Voltage References
      4. 9.3.4  System Clock Input
      5. 9.3.5  Sampling Mode
      6. 9.3.6  Reset Operation
      7. 9.3.7  Highpass Filter (HPF)
      8. 9.3.8  Overflow Flag
      9. 9.3.9  Zero Flag
      10. 9.3.10 Four-Wire (SPI) Serial Control
      11. 9.3.11 Control Data Word Format
      12. 9.3.12 Register Write Operation
      13. 9.3.13 Register Read Operation
      14. 9.3.14 Two-Wire (I2C) Serial Control
      15. 9.3.15 Packet Protocol
      16. 9.3.16 Write Operation
      17. 9.3.17 Read Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Mode Control
      2. 9.4.2 Hardware Control Mode Configuration
      3. 9.4.3 Audio Serial Port Operation
      4. 9.4.4 Audio Data Interface Formats and Timing
      5. 9.4.5 Synchronization With the Digital Audio System
    5. 9.5 Register Maps
      1. 9.5.1 Control Register Definitions (Software Mode Only)
      2. 9.5.2 Register Definitions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Analog Input and Output
        2. 10.2.2.2 PCM Interface
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Typical Circuit Connections
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1  Power-Supply Pins (VCCAD1/2, VCCDA1/2, and VDD1/2)
      2. 12.1.2  Grounding (AGNDAD1/2, AGNDDA1/2, and DGND1/2)
      3. 12.1.3  VIN1±, VIN2±, VIN3±, VIN4±, VIN5±, and VIN6± Pins
      4. 12.1.4  VCOMAD and VCOMDA Pins
      5. 12.1.5  VREFAD1/2 Pins
      6. 12.1.6  VOUT1±, VOU2±, VOUT3±, VOUT4±, VOUT5±, VOUT6±, VOUT7±, and VOUT8± Pins
      7. 12.1.7  MODE Pin
      8. 12.1.8  RST Pin
      9. 12.1.9  OVF Pin
      10. 12.1.10 System Clock and Audio Interface Clocks
      11. 12.1.11 PowerPAD
      12. 12.1.12 External Mute Control
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Documentation Support

13.2.1 Related Documentation

For related documentation, refer to the following:

  • PCM3168PAP IBIS Model Analog & Mixed-Signal (SLAC203)
  • PurePath™ Console Motherboard User's Guide (SLOU366)

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

I2C, I2S are trademarks of NXP Semiconductors.

PowerPAD is a trademark of Texas Instruments Incorporated.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.