SBASA12 December   2020 PCM6020-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: SPI Interface
    9. 7.9  Switching Characteristics: SPI Interface
    10. 7.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 7.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3 Input Channel Configuration
      4. 8.3.4 Reference Voltage
      5. 8.3.5 Microphone Bias
      6. 8.3.6 Input DC Fault Diagnostics
        1. 8.3.6.1 Fault Conditions
          1. 8.3.6.1.1 Input Pin Short to Ground
          2. 8.3.6.1.2 Input Pin Short to MICBIAS
          3. 8.3.6.1.3 Open Inputs
          4. 8.3.6.1.4 Short Between INxP and INxM
          5. 8.3.6.1.5 Input Pin Overvoltage
          6. 8.3.6.1.6 Input Pin Short to VBAT_IN
        2. 8.3.6.2 Fault Reporting
          1. 8.3.6.2.1 Overcurrent and Overtemperature Protection
      7. 8.3.7 Signal-Chain Processing
        1. 8.3.7.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.7.2 Programmable Channel Gain Calibration
        3. 8.3.7.3 Programmable Channel Phase Calibration
        4. 8.3.7.4 Programmable Digital High-Pass Filter
        5. 8.3.7.5 Programmable Digital Biquad Filters
        6. 8.3.7.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.7.7 Configurable Digital Decimation Filters
          1. 8.3.7.7.1 Linear Phase Filters
            1. 8.3.7.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.7.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.7.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.7.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.7.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.7.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.7.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.7.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.7.7.1.9 Sampling Rate: 768 kHz or 705.6 kHz
          2. 8.3.7.7.2 Low-Latency Filters
            1. 8.3.7.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.2.6 Sampling Rate: 192 kHz or 176.4 kHz
          3. 8.3.7.7.3 Ultra-Low-Latency Filters
            1. 8.3.7.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.3.6 Sampling Rate: 192 kHz or 176.4 kHz
            7. 8.3.7.7.3.7 Sampling Rate: 384 kHz or 352.8 kHz
      8. 8.3.8 Automatic Gain Controller (AGC)
      9. 8.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Sleep Mode or Software Shutdown
      3. 8.4.3 Active Mode
      4. 8.4.4 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
        2. 8.5.1.2 SPI Control Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 Registers Access Type
        2. 8.6.1.2 Page 0 Registers
        3. 8.6.1.3 Page 1 Registers
      2. 8.6.2 Programmable Coefficient Registers
        1. 8.6.2.1 Programmable Coefficient Registers: Page 2
        2. 8.6.2.2 Programmable Coefficient Registers: Page 3
        3. 8.6.2.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 2-Channel Analog Microphone Recording Using the PCM6020-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-9FAC8785-E216-468F-AB3E-28F81CAAEACD-low.gif Figure 6-1 RTV Package,32-Pin WQFN With Exposed Thermal Pad,Top View
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 AVDD Analog supply Analog power (3.3 V, nominal)
2 AREG Analog supply Analog regulator output voltage for analog supply (1.8 V, nominal)
3 BSTVDD Analog supply Boost converter supply voltage
4 BSTSW Analog supply Boost converter switch input
5 BSTOUT Analog supply Boost converter output voltage
6 MICBIAS Analog MICBIAS output (programmable output up to 9 V)
7 VREF Analog Analog reference voltage filter output
8 AVSS Analog supply Analog ground; short directly to the board ground plane
9 IN1P Analog input Analog input 1P pin
10 IN1M Analog input Analog input 1M pin
11 IN2P Analog input Analog input 2P pin
12 IN2M Analog input Analog input 2M pin
13 NC — Not used; pin must be grounded
14 NC — Not used; pin must be grounded
15 NC — Not used; pin must be grounded
16 NC — Not used; pin must be grounded
17 GPI2 Digital input General-purpose digital input-2 (multipurpose functions such as daisy-chain input, PLL input clock source, and so on)
18 GPIO3 Digital I/O General-purpose digital input/output-4 (multipurpose functions such as daisy-chain input, audio data output, PLL input clock source, interrupt, and so on)
19 GPI1 Digital input General-purpose digital input-1 (multipurpose functions such as daisy-chain input, PLL input clock source, and so on)
20 GPIO2 Digital I/O General-purpose digital input/output-2 (multipurpose functions such as daisy-chain input, audio data output, PLL input clock source, interrupt, and so on)
21 VBAT_IN Analog Analog VBAT input monitoring pin (used for input diagnostics)
22 SHDNZ Digital input Device hardware shutdown and reset (active low)
23 ADDR1_MISO Digital I/O For I2C operation: I2C slave address A1 pin.
For SPI operation: SPI slave output pin.
24 ADDR0_SCLK Digital input For I2C operation: I2C slave address A0 pin.
For SPI operation: SPI serial bit clock.
25 SCL_MOSI Digital input For I2C operation: clock pin for I2C control bus.
For SPI operation: SPI slave input pin.
26 SDA_SSZ Digital I/O For I2C operation: data pin for I2C control bus.
For SPI operation: SPI slave select pin.
27 IOVDD Digital supply Digital I/O power supply (1.8 V or 3.3 V, nominal)
28 GPIO1 Digital I/O General-purpose digital input/output-1 (multipurpose functions such as daisy-chain input, audio data output, PLL input clock source, interrupt, and so on)
29 SDOUT Digital output Audio serial data interface bus output
30 BCLK Digital I/O Audio serial data interface bus bit clock
31 FSYNC Digital I/O Audio serial data interface bus frame synchronization signal
32 DREG Digital supply Digital regulator output voltage for digital core supply (1.5 V, nominal)
Thermal Pad Thermal Pad (VSS) Ground supply Thermal pad shorted to the internal device ground. Short the thermal pad directly to the board ground plane.