SBASA30 December   2020 PCM6480-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: SPI Interface
    9. 7.9  Switching Characteristics: SPI Interface
    10. 7.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 7.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 7.12 Timing Requirements: PDM Digital Microphone Interface
    13. 7.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 7.14 Timing Diagrams
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Analog Input Channel Configuration
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Microphone Bias
      6. 8.3.6  Input DC Fault Diagnostics
        1. 8.3.6.1 Fault Conditions
          1. 8.3.6.1.1 Input Pin Short to Ground
          2. 8.3.6.1.2 Input Pin Short to MICBIAS
          3. 8.3.6.1.3 Open Inputs
          4. 8.3.6.1.4 Short Between INxP and INxM
          5. 8.3.6.1.5 Input Pin Overvoltage
          6. 8.3.6.1.6 Input Pin Short to VBAT_IN
        2. 8.3.6.2 Fault Reporting
          1. 8.3.6.2.1 Overcurrent and Overtemperature Protection
      7. 8.3.7  Digital PDM Microphone Record Channel
      8. 8.3.8  Signal-Chain Processing
        1. 8.3.8.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.8.2 Programmable Channel Gain Calibration
        3. 8.3.8.3 Programmable Channel Phase Calibration
        4. 8.3.8.4 Programmable Digital High-Pass Filter
        5. 8.3.8.5 Programmable Digital Biquad Filters
        6. 8.3.8.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.8.7 Configurable Digital Decimation Filters
          1. 8.3.8.7.1 Linear Phase Filters
            1. 8.3.8.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.8.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.8.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.8.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.8.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.8.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.8.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.8.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.8.7.1.9 Sampling Rate: 768 kHz or 705.6 kHz
          2. 8.3.8.7.2 Low-Latency Filters
            1. 8.3.8.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.8.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.8.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.8.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.8.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.8.7.2.6 Sampling Rate: 192 kHz or 176.4 kHz
          3. 8.3.8.7.3 Ultra-Low-Latency Filters
            1. 8.3.8.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.8.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.8.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.8.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.8.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.8.7.3.6 Sampling Rate: 192 kHz or 176.4 kHz
            7. 8.3.8.7.3.7 Sampling Rate: 384 kHz or 352.8 kHz
      9. 8.3.9  Automatic Gain Controller (AGC)
      10. 8.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Sleep Mode or Software Shutdown
      3. 8.4.3 Active Mode
      4. 8.4.4 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
        2. 8.5.1.2 SPI Control Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 Registers Access Type
        2. 8.6.1.2 Page 0 Registers
        3. 8.6.1.3 Page 1 Registers
      2. 8.6.2 Programmable Coefficient Registers
        1. 8.6.2.1 Programmable Coefficient Registers: Page 2
        2. 8.6.2.2 Programmable Coefficient Registers: Page 3
        3. 8.6.2.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Four-Channel Analog Microphone and Four-Channel PDM Microphone Simultaneous Recording Using the PCM6480-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Hardware Shutdown

The device enters hardware shutdown mode when the SHDNZ pin is asserted low or the AVDD supply voltage is not applied to the device. In hardware shutdown mode, the device consumes the minimum quiescent current from the AVDD supply. All configuration registers and programmable coefficients lose their value in this mode, and I2C or SPI communication to the device is not supported.

If the SHDNZ pin is asserted low when the device is in active mode, the device ramps down volume on the record data, powers down the analog and digital blocks, and puts the device into hardware shutdown mode in 25 ms (typical). The device can also be immediately put into hardware shutdown mode from active mode if the SHDNZ_CFG[1:0], P0_R5_D[3:2], register bits are set to 2'b00. After the SHDNZ pin is asserted low, and after the device enters hardware shutdown mode, keep the SHDNZ pin low for at least 1 ms before releasing SHDNZ for further device operation.

Assert the SHDNZ pin high only when the IOVDD supply settles to a steady voltage level. When the SHDNZ pin goes high, the device sets all configuration registers and programmable coefficients to their default values, and then enters sleep mode.