SBASA30 December   2020 PCM6480-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: SPI Interface
    9. 7.9  Switching Characteristics: SPI Interface
    10. 7.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 7.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 7.12 Timing Requirements: PDM Digital Microphone Interface
    13. 7.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 7.14 Timing Diagrams
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Analog Input Channel Configuration
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Microphone Bias
      6. 8.3.6  Input DC Fault Diagnostics
        1. 8.3.6.1 Fault Conditions
          1. 8.3.6.1.1 Input Pin Short to Ground
          2. 8.3.6.1.2 Input Pin Short to MICBIAS
          3. 8.3.6.1.3 Open Inputs
          4. 8.3.6.1.4 Short Between INxP and INxM
          5. 8.3.6.1.5 Input Pin Overvoltage
          6. 8.3.6.1.6 Input Pin Short to VBAT_IN
        2. 8.3.6.2 Fault Reporting
          1. 8.3.6.2.1 Overcurrent and Overtemperature Protection
      7. 8.3.7  Digital PDM Microphone Record Channel
      8. 8.3.8  Signal-Chain Processing
        1. 8.3.8.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.8.2 Programmable Channel Gain Calibration
        3. 8.3.8.3 Programmable Channel Phase Calibration
        4. 8.3.8.4 Programmable Digital High-Pass Filter
        5. 8.3.8.5 Programmable Digital Biquad Filters
        6. 8.3.8.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.8.7 Configurable Digital Decimation Filters
          1. 8.3.8.7.1 Linear Phase Filters
            1. 8.3.8.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.8.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.8.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.8.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.8.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.8.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.8.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.8.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.8.7.1.9 Sampling Rate: 768 kHz or 705.6 kHz
          2. 8.3.8.7.2 Low-Latency Filters
            1. 8.3.8.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.8.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.8.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.8.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.8.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.8.7.2.6 Sampling Rate: 192 kHz or 176.4 kHz
          3. 8.3.8.7.3 Ultra-Low-Latency Filters
            1. 8.3.8.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.8.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.8.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.8.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.8.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.8.7.3.6 Sampling Rate: 192 kHz or 176.4 kHz
            7. 8.3.8.7.3.7 Sampling Rate: 384 kHz or 352.8 kHz
      9. 8.3.9  Automatic Gain Controller (AGC)
      10. 8.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Sleep Mode or Software Shutdown
      3. 8.4.3 Active Mode
      4. 8.4.4 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
        2. 8.5.1.2 SPI Control Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 Registers Access Type
        2. 8.6.1.2 Page 0 Registers
        3. 8.6.1.3 Page 1 Registers
      2. 8.6.2 Programmable Coefficient Registers
        1. 8.6.2.1 Programmable Coefficient Registers: Page 2
        2. 8.6.2.2 Programmable Coefficient Registers: Page 3
        3. 8.6.2.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Four-Channel Analog Microphone and Four-Channel PDM Microphone Simultaneous Recording Using the PCM6480-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.2 Sleep Mode or Software Shutdown

In sleep mode or software shutdown mode, the device consumes very low quiescent current from the AVDD supply and, at the same time, allows the I2C or SPI communication to wake the device for active operation.

The device can also enter sleep mode when the host device sets the SLEEP_ENZ, P0_R2_D0 bit to 1'b0. If the SLEEP_ENZ bit is asserted low when the device is in active mode, the device ramps down the volume on the record data, powers down the analog and digital blocks, and enters sleep mode. However, the device still continues to retain the last programmed value of the device configuration registers and programmable coefficients.

In sleep mode, do not perform any I2C or SPI transactions, except for exiting sleep mode in order to enter active mode. After entering sleep mode, wait at least 10 ms before starting I2C or SPI transactions to exit sleep mode.