SBASAH3A April   2022  – September 2022 PCMD3140-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 6.9  Switching Characteristics: TDM, I2S or LJ Interface
    10.     Timing Requirements: PDM Digital Microphone Interface
    11. 6.10 Switching Characteristics: PDM Digial Microphone Interface
    12. 6.11 Timing Diagrams
    13. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Reference Voltage
      4. 7.3.4 Microphone Bias
      5. 7.3.5 Digital PDM Microphone Record Channel
      6. 7.3.6 Signal-Chain Processing
        1. 7.3.6.1 Programmable Digital Volume Control
        2. 7.3.6.2 Programmable Channel Gain Calibration
        3. 7.3.6.3 Programmable Channel Phase Calibration
        4. 7.3.6.4 Programmable Digital High-Pass Filter
        5. 7.3.6.5 Programmable Digital Biquad Filters
        6. 7.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 7.3.6.7 Configurable Digital Decimation Filters
          1. 7.3.6.7.1 Linear Phase Filters
            1. 7.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 7.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 7.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 7.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 7.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 7.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 7.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 7.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 7.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 7.3.6.7.2 Low-Latency Filters
            1. 7.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 7.3.6.7.3 Ultra-Low-Latency Filters
            1. 7.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 7.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 7.3.7 Voice Activity Detection (VAD)
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode or Software Shutdown
      2. 7.4.2 Active Mode
      3. 7.4.3 Software Reset
    5. 7.5 Programming
      1. 7.5.1 Control Serial Interfaces
        1. 7.5.1.1 I2C Control Interface
          1. 7.5.1.1.1 General I2C Operation
          2. 7.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 7.5.1.1.2.1 I2C Single-Byte Write
            2. 7.5.1.1.2.2 I2C Multiple-Byte Write
            3. 7.5.1.1.2.3 I2C Single-Byte Read
            4. 7.5.1.1.2.4 I2C Multiple-Byte Read
    6. 7.6 Register Maps
      1. 7.6.1 Page 0 Registers
      2. 7.6.2 Page 1 Registers
      3. 7.6.3 Programmable Coefficient Registers
        1. 7.6.3.1 Programmable Coefficient Registers: Page 2
        2. 7.6.3.2 Programmable Coefficient Registers: Page 3
        3. 7.6.3.3 Programmable Coefficient Registers: Page 4
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Four-Channel Digital PDM Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 8.2.1.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements: I2C Interface

at TA = 25°C, IOVDD = 3.3 V or 1.8 V (unless otherwise noted); see Figure 6-1 for timing diagram
MIN NOM MAX UNIT
STANDARD-MODE
fSCL SCL clock frequency 0 100 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4 μs
tLOW Low period of the SCL clock 4.7 μs
tHIGH High period of the SCL clock 4 μs
tSU;STA Setup time for a repeated START condition 4.7 μs
tHD;DAT Data hold time 0 3.45 μs
tSU;DAT Data setup time 250 ns
tr SDA and SCL rise time 1000 ns
tf SDA and SCL fall time 300 ns
tSU;STO Setup time for STOP condition 4 μs
tBUF Bus free time between a STOP and START condition 4.7 μs
FAST-MODE
fSCL SCL clock frequency 0 400 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 0.6 μs
tLOW Low period of the SCL clock 1.3 μs
tHIGH High period of the SCL clock 0.6 μs
tSU;STA Setup time for a repeated START condition 0.6 μs
tHD;DAT Data hold time 0 0.9 μs
tSU;DAT Data setup time 100 ns
tr SDA and SCL rise time 20 300 ns
tf SDA and SCL fall time 20 × (IOVDD / 5.5 V) 300 ns
tSU;STO Setup time for STOP condition 0.6 μs
tBUF Bus free time between a STOP and START condition 1.3 μs
FAST-MODE PLUS
fSCL SCL clock frequency 0 1000 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 0.26 μs
tLOW Low period of the SCL clock 0.5 μs
tHIGH High period of the SCL clock 0.26 μs
tSU;STA Setup time for a repeated START condition 0.26 μs
tHD;DAT Data hold time 0 μs
tSU;DAT Data setup time 50 ns
tr SDA and SCL rise time 120 ns
tf SDA and SCL fall time 20 × (IOVDD / 5.5 V) 120 ns
tSU;STO Setup time for STOP condition 0.26 μs
tBUF Bus free time between a STOP and START condition 0.5 μs