SBASAH3A April   2022  – September 2022 PCMD3140-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 6.9  Switching Characteristics: TDM, I2S or LJ Interface
    10.     Timing Requirements: PDM Digital Microphone Interface
    11. 6.10 Switching Characteristics: PDM Digial Microphone Interface
    12. 6.11 Timing Diagrams
    13. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Reference Voltage
      4. 7.3.4 Microphone Bias
      5. 7.3.5 Digital PDM Microphone Record Channel
      6. 7.3.6 Signal-Chain Processing
        1. 7.3.6.1 Programmable Digital Volume Control
        2. 7.3.6.2 Programmable Channel Gain Calibration
        3. 7.3.6.3 Programmable Channel Phase Calibration
        4. 7.3.6.4 Programmable Digital High-Pass Filter
        5. 7.3.6.5 Programmable Digital Biquad Filters
        6. 7.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 7.3.6.7 Configurable Digital Decimation Filters
          1. 7.3.6.7.1 Linear Phase Filters
            1. 7.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 7.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 7.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 7.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 7.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 7.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 7.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 7.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 7.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 7.3.6.7.2 Low-Latency Filters
            1. 7.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 7.3.6.7.3 Ultra-Low-Latency Filters
            1. 7.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 7.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 7.3.7 Voice Activity Detection (VAD)
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode or Software Shutdown
      2. 7.4.2 Active Mode
      3. 7.4.3 Software Reset
    5. 7.5 Programming
      1. 7.5.1 Control Serial Interfaces
        1. 7.5.1.1 I2C Control Interface
          1. 7.5.1.1.1 General I2C Operation
          2. 7.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 7.5.1.1.2.1 I2C Single-Byte Write
            2. 7.5.1.1.2.2 I2C Multiple-Byte Write
            3. 7.5.1.1.2.3 I2C Single-Byte Read
            4. 7.5.1.1.2.4 I2C Multiple-Byte Read
    6. 7.6 Register Maps
      1. 7.6.1 Page 0 Registers
      2. 7.6.2 Page 1 Registers
      3. 7.6.3 Programmable Coefficient Registers
        1. 7.6.3.1 Programmable Coefficient Registers: Page 2
        2. 7.6.3.2 Programmable Coefficient Registers: Page 3
        3. 7.6.3.3 Programmable Coefficient Registers: Page 4
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Four-Channel Digital PDM Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 8.2.1.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) PCMD3140 UNIT
RTW (WQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 55.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.1 °C/W
RθJB Junction-to-board thermal resistance 23.4 °C/W
ψJT Junction-to-top characterization parameter 0.6 °C/W
ψJB Junction-to-board characterization parameter 23.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 16.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.