SBASB65 August   2024 PGA302

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Receiving Notification of Documentation Updates
    2. 4.2 Support Resources
    3. 4.3 Trademarks
    4. 4.4 Electrostatic Discharge Caution
    5. 4.5 Glossary
  6. 5Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

1 Features

  • Analog features:
    • Dual channel analog front-end
    • On-chip temperature sensor
    • Programmable gain up to 200V/V
    • 16-bit sigma-delta analog-to-digital converter
  • Digital features:
    • 3rd-order linearity compensation algorithm
    • EEPROM memory for device configuration, calibration data, and user data
    • I2C interface
    • One-wire interface through power line
  • General features:
    • AFE sensor input, power supply, and output buffer diagnostics
    • Memory built-in self-test (MBIST)
    • Watchdog
    • Power management control