SLASEJ4C April 2017 – February 2023 PGA460
PRODUCTION DATA
THERMAL METRIC(1) | PGA460 | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 96.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 42 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 41.3 | °C/W |