SLTS278J November   2010  – March 2020 PTH08T250W

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1. Table 1. Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Electrical Characteristics
    3. 7.3 Typical Characteristics (VI = 12 V)
    4. 7.4 Typical Characteristics (VI = 5 V)
  8. Detailed Description
    1. 8.1 Overview: TurboTrans™ Technology
    2. 8.2 Feature Description
      1. 8.2.1 Soft-Start Power-Up
      2. 8.2.2 Differential Output Voltage Remote Sense
      3. 8.2.3 Overcurrent Protection
      4. 8.2.4 Overtemperature Protection (OTP)
  9. Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1  Adjusting the Output Voltage
        2. 9.1.1.2  Capacitor Recommendations for the PTH08T250W Power Module
          1. 9.1.1.2.1 Capacitor Technologies
          2. 9.1.1.2.2 Input Capacitor (Required)
          3. 9.1.1.2.3 Input Capacitor Information
          4. 9.1.1.2.4 Output Capacitor (Required)
          5. 9.1.1.2.5 Output Capacitor Information
          6. 9.1.1.2.6 TurboTrans Output Capacitance
          7. 9.1.1.2.7 Non-TurboTrans Output Capacitance
          8. 9.1.1.2.8 Designing for Fast Load Transients
          9. 9.1.1.2.9 Capacitor Table
        3. 9.1.1.3  TurboTrans™ Technology
        4. 9.1.1.4  TurboTrans™ Selection
          1. 9.1.1.4.1 PTH08T250W Type B Capacitors
            1. 9.1.1.4.1.1 RTT Resistor Selection
          2. 9.1.1.4.2 PTH08T250W Type C Capacitors
            1. 9.1.1.4.2.1 RTT Resistor Selection
        5. 9.1.1.5  Undervoltage Lockout (UVLO)
          1. 9.1.1.5.1 UVLO Adjustment
        6. 9.1.1.6  On/Off Inhibit
        7. 9.1.1.7  Current Sharing
          1. 9.1.1.7.1 Current Sharing and TurboTrans
            1. 9.1.1.7.1.1 Current Sharing Thermal Derating Curves
            2. 9.1.1.7.1.2 Current Sharing Layout
        8. 9.1.1.8  Prebias Startup Capability
        9. 9.1.1.9  SmartSync Technology
        10. 9.1.1.10 Auto-Track™ Function
          1. 9.1.1.10.1 How Auto-Track™ Works
          2. 9.1.1.10.2 Typical Auto-Track Application
          3. 9.1.1.10.3 Notes on Use of Auto-Track™
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape, Reel, and Tray Drawings

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BCU|22
  • ECT|22
  • ECU|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

(Voltages are with respect to GND)
UNIT
Vtrack Track pin voltage –0.3 to VI + 0.3 V
TA Operating temperature range Over VI range –40 to 85 °C
Twave Wave soldering temperature Surface temperature of module body or pins
(5 seconds maximum)
AD suffix 260
Treflow Solder reflow temperature Surface temperature of module body or pins AS suffix 235(1)
AZ suffix 260(1)
Tstg Storage temperature Storage temperature of module removed from shipping package –55 to 125
Tpkg Packaging temperature Shipping Tray or Tape and Reel storage or bake temperature 45
Mechanical shock Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 sine, mounted AD suffix 500 G
AS and AZ suffix 125
Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20
Weight 16.7 grams
Flammability Meets UL94V-O
During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the stated maximum.