SLTS278J November   2010  – March 2020 PTH08T250W

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1. Table 1. Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Electrical Characteristics
    3. 7.3 Typical Characteristics (VI = 12 V)
    4. 7.4 Typical Characteristics (VI = 5 V)
  8. 8 Detailed Description
    1. 8.1 Overview: TurboTrans™ Technology
    2. 8.2 Feature Description
      1. 8.2.1 Soft-Start Power-Up
      2. 8.2.2 Differential Output Voltage Remote Sense
      3. 8.2.3 Overcurrent Protection
      4. 8.2.4 Overtemperature Protection (OTP)
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1  Adjusting the Output Voltage
        2. 9.1.1.2  Capacitor Recommendations for the PTH08T250W Power Module
          1. 9.1.1.2.1 Capacitor Technologies
          2. 9.1.1.2.2 Input Capacitor (Required)
          3. 9.1.1.2.3 Input Capacitor Information
          4. 9.1.1.2.4 Output Capacitor (Required)
          5. 9.1.1.2.5 Output Capacitor Information
          6. 9.1.1.2.6 TurboTrans Output Capacitance
          7. 9.1.1.2.7 Non-TurboTrans Output Capacitance
          8. 9.1.1.2.8 Designing for Fast Load Transients
          9. 9.1.1.2.9 Capacitor Table
        3. 9.1.1.3  TurboTrans™ Technology
        4. 9.1.1.4  TurboTrans™ Selection
          1. 9.1.1.4.1 PTH08T250W Type B Capacitors
            1. 9.1.1.4.1.1 RTT Resistor Selection
          2. 9.1.1.4.2 PTH08T250W Type C Capacitors
            1. 9.1.1.4.2.1 RTT Resistor Selection
        5. 9.1.1.5  Undervoltage Lockout (UVLO)
          1. 9.1.1.5.1 UVLO Adjustment
        6. 9.1.1.6  On/Off Inhibit
        7. 9.1.1.7  Current Sharing
          1. 9.1.1.7.1 Current Sharing and TurboTrans
            1. 9.1.1.7.1.1 Current Sharing Thermal Derating Curves
            2. 9.1.1.7.1.2 Current Sharing Layout
        8. 9.1.1.8  Prebias Startup Capability
        9. 9.1.1.9  SmartSync Technology
        10. 9.1.1.10 Auto-Track™ Function
          1. 9.1.1.10.1 How Auto-Track™ Works
          2. 9.1.1.10.2 Typical Auto-Track Application
          3. 9.1.1.10.3 Notes on Use of Auto-Track™
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape, Reel, and Tray Drawings

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BCU|22
  • ECT|22
  • ECU|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1.7.1.2 Current Sharing Layout

In current sharing applications the VI pins of both modules must be connected to the same input bus. The VO pins of both modules are connected together to power the load. The GND pins of both modules are connected via the GND plane. Four other inter-connection pins are connected between the modules. Figure 27 shows the required layout of the inter-connection pins for two modules configured to share current. Notice that the Share (pin 2) connection is routed between the Comp (pin 3) and CLKIO (pin 5) connections. AGND (pin 4) should be connected as a thicker trace on an adjacent layer, running parallel to pins 2, 3 and 5. AGND must not be connected to the GND plane.

PTH08T250W v07107_lts278.gifFigure 27. Recommended Layout of Inter-Connection Pins Between Two Current Sharing Modules