SLTS278J November   2010  – March 2020 PTH08T250W

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1. Table 1. Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Electrical Characteristics
    3. 7.3 Typical Characteristics (VI = 12 V)
    4. 7.4 Typical Characteristics (VI = 5 V)
  8. Detailed Description
    1. 8.1 Overview: TurboTrans™ Technology
    2. 8.2 Feature Description
      1. 8.2.1 Soft-Start Power-Up
      2. 8.2.2 Differential Output Voltage Remote Sense
      3. 8.2.3 Overcurrent Protection
      4. 8.2.4 Overtemperature Protection (OTP)
  9. Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1  Adjusting the Output Voltage
        2. 9.1.1.2  Capacitor Recommendations for the PTH08T250W Power Module
          1. 9.1.1.2.1 Capacitor Technologies
          2. 9.1.1.2.2 Input Capacitor (Required)
          3. 9.1.1.2.3 Input Capacitor Information
          4. 9.1.1.2.4 Output Capacitor (Required)
          5. 9.1.1.2.5 Output Capacitor Information
          6. 9.1.1.2.6 TurboTrans Output Capacitance
          7. 9.1.1.2.7 Non-TurboTrans Output Capacitance
          8. 9.1.1.2.8 Designing for Fast Load Transients
          9. 9.1.1.2.9 Capacitor Table
        3. 9.1.1.3  TurboTrans™ Technology
        4. 9.1.1.4  TurboTrans™ Selection
          1. 9.1.1.4.1 PTH08T250W Type B Capacitors
            1. 9.1.1.4.1.1 RTT Resistor Selection
          2. 9.1.1.4.2 PTH08T250W Type C Capacitors
            1. 9.1.1.4.2.1 RTT Resistor Selection
        5. 9.1.1.5  Undervoltage Lockout (UVLO)
          1. 9.1.1.5.1 UVLO Adjustment
        6. 9.1.1.6  On/Off Inhibit
        7. 9.1.1.7  Current Sharing
          1. 9.1.1.7.1 Current Sharing and TurboTrans
            1. 9.1.1.7.1.1 Current Sharing Thermal Derating Curves
            2. 9.1.1.7.1.2 Current Sharing Layout
        8. 9.1.1.8  Prebias Startup Capability
        9. 9.1.1.9  SmartSync Technology
        10. 9.1.1.10 Auto-Track™ Function
          1. 9.1.1.10.1 How Auto-Track™ Works
          2. 9.1.1.10.2 Typical Auto-Track Application
          3. 9.1.1.10.3 Notes on Use of Auto-Track™
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape, Reel, and Tray Drawings

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BCU|22
  • ECT|22
  • ECU|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Current Sharing Thermal Derating Curves

The temperature derating curves in Figure 23 through Figure 26 represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to two PTH08T250W modules soldered directly to a 100 mm x 200 mm double-sided PCB with 2 oz. copper and the direction of airflow from pins 10 to pins 22. For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Refer to the mechanical specification for more information.

PTH08T250W cs_12v33vx_lts278.gifFigure 23. Ambient Temperature vs. Output Current
PTH08T250W cs_5v33v_lts278.gifFigure 25. Ambient Temperature vs. Output Current
PTH08T250W cs_12v12v_lts278.gifFigure 24. Ambient Temperature vs. Output Current
PTH08T250W cs_5v12v_lts278.gifFigure 26. Ambient Temperature vs. Output Current