SLOS412E April   2003  – November 2024 RC4580

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Unity-Gain Bandwidth
      2. 6.3.2 Common-Mode Rejection Ratio
      3. 6.3.3 Slew Rate
    4. 6.4 Device Functional Mode
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Amplifier Selection
        2. 7.1.2.2 Passive Component Selection
      3. 7.1.3 Application Curves
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DDF|8
  • DGK|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (November 2014) to Revision E (November 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the P (PDIP, 8), DGK (VSSOP, 8), and DDF (SOT-23, 8) packages to the data sheetGo
  • Changed the slew rate value listed in the Slew Rate section from: 5V/ms to: 5V/µs to match the slew rate values listed in the Features section and Electrical Characteristics tableGo
  • Deleted references to the Circuit Board Layout Techniques application noteGo

Changes from Revision C (March 2004) to Revision D (November 2014)

  • Added Applications, Device Information table, Pin Functions table, Handling Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Removed Ordering Information table.Go
  • Changed TA = 25°C to TA = –40°C to 125°C in condition statement for Electrical Characteristics table and Operational Characteristics table.Go