SBOS283E September   2003  – December 2024 REF1112

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Shunt Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 MicroPOWER 3μA, 1V Voltage Reference
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 2.5V Reference on 1μA
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
      4. 7.2.4 Adjustable Voltage Shunt Reference
      5. 7.2.5 Level Shift to Achieve Full ADC Input Range
      6. 7.2.6 Stable Current Source
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)REF1112UNIT
DBZ (SOT-23)
3 PINS
RθJAJunction-to-ambient thermal resistance219°C/W
RθJC(top)Junction-to-case (top) thermal resistance99°C/W
RθJBJunction-to-board thermal resistance79°C/W
ψJTJunction-to-top characterization parameter6.7°C/W
ψJBJunction-to-board characterization parameter79.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.