SBOS283E September   2003  – December 2024 REF1112

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Shunt Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 MicroPOWER 3μA, 1V Voltage Reference
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 2.5V Reference on 1μA
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
      4. 7.2.4 Adjustable Voltage Shunt Reference
      5. 7.2.5 Level Shift to Achieve Full ADC Input Range
      6. 7.2.6 Stable Current Source
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (March 2018) to Revision E (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated ZR and ΔVR/ΔIR Go

Changes from Revision C (March 2008) to Revision D (March 2018)

  • Added Device Information table, Pin Configuration and Functions section, Absolute Maximum Ratings table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed Features section Go
  • Changed key graphic text note from: NC indicates pin can be left unconnected to: NC indicates the pin must be left unconnected or connected to GND Go
  • Removed the Package/Ordering Information table and moved the information over to the Mechanical, Packaging, and Orderable Information sectionGo