SBOSA80 December   2021 REF20-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VREF and VBIAS Tracking
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Low-Side, Current-Sensing Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Shunt Resistor
          2. 10.2.1.2.2 Differential Amplifier
          3. 10.2.1.2.3 Voltage Reference
          4. 10.2.1.2.4 Error Calculations
          5. 10.2.1.2.5 Application Curves
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Typical Characteristics

At TA = 25°C, IL = 0 mA, VIN = 5 V power supply, CL = 0 µF, and 2.5 V output, unless otherwise noted.

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Figure 7-1 Initial Accuracy Distribution (VREF)
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Figure 7-3 Initial Accuracy Distribution (VBIAS)
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Figure 7-5 VREF – 2 × VBIAS Distribution
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Refer to the Section 8.1 section for more information.
Figure 7-7 Solder Heat Shift Distribution (VREF)
GUID-2F48F8E4-2F91-4784-A0F6-9684489F2ED6-low.pngFigure 7-9 Output Voltage Accuracy (VREF) vs Temperature
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VREF output
Figure 7-11 Output Voltage Change vs Load Current (VREF)
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VREF outputIL = 20 mA
Figure 7-13 Load Regulation Sourcing vs Temperature (VREF)
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VREF outputIL = –20 mA
Figure 7-15 Load Regulation Sinking vs Temperature (VREF)
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VREF output
Figure 7-17 Line Regulation vs Temperature (VREF)
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CL = 0 µF
Figure 7-19 Power-Supply Rejection Ratio vs Frequency
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CL = 1 µF
Figure 7-21 Line Transient Response
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CL = 1 µFIL = ±1-mA step
Figure 7-23 Load Transient Response
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CL = 1 µFIL = ±20-mA step
Figure 7-25 Load Transient Response
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Figure 7-27 Minimum Dropout Voltage vs Load Current
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CL = 10 µF
Figure 7-29 Turn-On Settling Time
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Figure 7-31 Quiescent Current vs Input Voltage
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VBIAS output
Figure 7-33 0.1-Hz to 10-Hz Noise (VBIAS)
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VREF output
Figure 7-35 Output Impedance vs Frequency (VREF)
GUID-D7156060-C731-421B-AB43-432236B2DD83-low.pngFigure 7-37 Thermal Hysteresis Distribution (VREF)
Figure 7-39 Long-Term Stability (First 1000 Hours)
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–40°C ≤ TA ≤ 125°C
Figure 7-2 Drift Distribution (VREF)
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–40°C ≤ TA ≤ 125°C
Figure 7-4 Drift Distribution (VBIAS)
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–40°C ≤ TA ≤ 125°C
Figure 7-6 Distribution of VREF – 2 × VBIAS Drift Tracking Over Temperature
GUID-BFD500EB-6FF5-4DD4-B37A-AB54592DADD9-low.png
Refer to the Section 8.1 section for more information.
Figure 7-8 Solder Heat Shift Distribution (VBIAS)
GUID-0902CADA-3D9C-4B53-B795-C65FD19A3B5B-low.pngFigure 7-10 VREF – 2 × VBIAS Tracking vs Temperature
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VBIAS output
Figure 7-12 Output Voltage Change vs Load Current (VBIAS)
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VBIAS outputIL = 20 mA
Figure 7-14 Load Regulation Sourcing vs Temperature (VBIAS)
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VBIAS outputIL = –20 mA
Figure 7-16 Load Regulation Sinking vs Temperature (VBIAS)
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VBIAS output
Figure 7-18 Line Regulation vs Temperature (VBIAS)
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CL = 10 µF
Figure 7-20 Power-Supply Rejection Ratio vs Frequency
GUID-AF53387C-4808-48B7-BC32-7EBF65FDD617-low.png
CL = 10 µF
Figure 7-22 Line Transient Response
GUID-86EC0B1D-37FD-48A5-B60D-975E7F3BABFF-low.png
CL = 10 µFIL = ±1-mA step
Figure 7-24 Load Transient Response
GUID-735BF257-216B-4717-97C2-ED50A0CA5974-low.png
CL = 10 µFIL = ±20-mA step
Figure 7-26 Load Transient Response
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CL = 1 µF
Figure 7-28 Turn-On Settling Time
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Figure 7-30 Quiescent Current vs Temperature
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VREF output
Figure 7-32 0.1-Hz to 10-Hz Noise (VREF)
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Figure 7-34 Output Voltage Noise Spectrum
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VBIAS output
Figure 7-36 Output Impedance vs Frequency (VBIAS)
GUID-1AF10B89-8BCE-40E5-9D95-C621DF8FC9EE-low.pngFigure 7-38 Thermal Hysteresis Distribution (VBIAS)