SBOS392H August   2007  – August 2019 REF3312 , REF3318 , REF3320 , REF3325 , REF3330 , REF3333

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      REF3312 in a Single-Supply Signal Chain
      2.      Dropout Voltage vs Load Current
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1. Table 1. Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Thermal Hysteresis
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Start-Up Time
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Power Dissipation
      4. 9.3.4 Noise Performance
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 REF3312 in a Bipolar Signal-Chain Configuration
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Op Amp Level-Shift Design
          2. 10.2.1.2.2 Differential Input Attenuator Design
          3. 10.2.1.2.3 Input Filtering
          4. 10.2.1.2.4 Component Selection
            1. 10.2.1.2.4.1 Voltage References
            2. 10.2.1.2.4.2 Op Amp
          5. 10.2.1.2.5 Input Attenuation and Level Shifting
          6. 10.2.1.2.6 Input Filtering
          7. 10.2.1.2.7 Passive Component Tolerances and Materials
        3. 10.2.1.3 Application Curves
          1. 10.2.1.3.1 DC Performance
          2. 10.2.1.3.2 AC Performance
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) REF33xx REF3325, REF3330 UNIT
DCK (SC70) DBZ (SOT-23) RSE (UQFN)
3 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 279.7 313.1 61.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 136.3 144.0 32.6 °C/W
RθJB Junction-to-board thermal resistance 56.9 109.3 16.0 °C/W
ψJT Junction-to-top characterization parameter 11.0 18.2 1.3 °C/W
ψJB Junction-to-board characterization parameter 56.1 107.9 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.