SNAS845 august   2023 REF35-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Temperature Coefficient
    3. 8.3 Long-Term Stability
    4. 8.4 Thermal Hysteresis
    5. 8.5 Noise Performance
      1. 8.5.1 Low-Frequency (1/f) Noise
      2. 8.5.2 Broadband Noise
    6. 8.6 Power Dissipation
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 EN Pin
      3. 9.3.3 NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Start-Up
      3. 9.4.3 Output Transient Behavior
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Negative Reference Voltage
    3. 10.3 Typical Application: Precision Power Supply and Reference
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
        1. 10.3.2.1 Selection of Reference
        2. 10.3.2.2 Input and Output Capacitors
        3. 10.3.2.3 Selection of ADC
      3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, VIN = VEN = VREF + 0.3 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)

GUID-20230807-SS0I-WN95-7Q85-XPBZZB8T44SV-low.svgFigure 7-1 Output Voltage Drift vs Free-Air Temperature
GUID-3999292A-6EA7-4664-902C-B7B2294EE734-low.svgFigure 7-3 0.1 Hz to 10 Hz Noise Distribution
(VREF = 1.25 V, CNR = Open, IL = 0 mA)
GUID-2B8A31D5-5129-4B0C-BCE3-33EA7E3F8A1F-low.svgFigure 7-5 0.1 Hz to 10 Hz Noise Distribution
(VREF = 2.5 V, CL = 1 μF, CNR = Open)
GUID-6F5B2DD1-49FC-48CC-9ECE-C1AB8042570E-low.svgFigure 7-7 0.1 Hz to 10 Hz Noise Distribution
(VREF = 5 V, CNR = Open, IL = 0 mA)
GUID-7D746B56-CA90-4E95-BDA4-A45CB426EC1E-low.svgFigure 7-9 Noise Density vs Frequency
(VREF = 2.5 V, IL = 0 mA)
GUID-20230808-SS0I-7724-TPDG-CKWRKG803GSP-low.svgFigure 7-11 Load Regulation (Sourcing 10 mA) vs Free-Air Temperature
GUID-460CAD15-59AC-4F8E-85D4-0DD65262A1D8-low.svgFigure 7-13 Load Transient Response
(VREF = 2.5 V, CL = 10 μF)
GUID-D4F4DD15-8809-4CEE-9649-9877C36C2D7D-low.svgFigure 7-15 Load Transient Response
(VREF = 2.5 V, CL = 1 μF)
GUID-8F98D581-6CBB-4294-ACEE-2A27EBB17618-low.svgFigure 7-17 Load Transient Response
(VREF = 1.25 V, CL = 1 μF)
GUID-20230808-SS0I-DHSB-DDZ2-2C9JF5RRJQXX-low.svgFigure 7-19 Line Regulation vs Free-Air Temperature
GUID-1E74D9A1-9330-4B95-BE8C-5DD4A0419DAC-low.svgFigure 7-21 Line Transient Response
(VREF = 2.5 V, CL = 1 μF)
GUID-20230807-SS0I-D26R-7WWK-4G89Q62Z2CMZ-low.svgFigure 7-23 Output Impedance
GUID-20230808-SS0I-HTMW-T6KW-MCWR1DZFJPVR-low.svgFigure 7-25 Dropout Voltage vs Free-Air Temperature
GUID-20230807-SS0I-8RGP-1NRS-SQHQHWS4WXTN-low.svgFigure 7-27 Long Term Stability - 1000 hours (VREF)
GUID-20230807-SS0I-RRGW-0VFQ-CWRLZRLKZKZC-low.svgFigure 7-2 Initial Accuracy Distribution
GUID-D270F29F-A548-40C6-88E7-0503C8561C26-low.svgFigure 7-4 0.1 Hz to 10 Hz Noise Distribution
(VREF = 2.5 V, CNR = Open, IL = 0 mA)
GUID-425A6712-E484-4067-8972-3EA529586751-low.svgFigure 7-6 0.1 Hz to 10 Hz Noise Distribution
(VREF = 2.5 V, CL = 1 μF, IL = 0 mA)
GUID-6137D5C6-CFCD-4356-AC01-8481A66758A9-low.svgFigure 7-8 Noise Density vs Frequency
(VREF = 1.25 V, IL = 0 mA)
GUID-5C89054B-357E-4AEE-A610-0D84F7778E06-low.svgFigure 7-10 Noise Density vs Frequency
(VREF = 5 V, IL = 0 mA)
GUID-20230808-SS0I-QLVS-PDXZ-V7GBSJWDS1MM-low.svgFigure 7-12 Load Regulation (Sinking 5 mA) vs Free-Air Temperature
GUID-D38B7CCC-2724-4F50-BF71-2D1D369C5159-low.svgFigure 7-14 Load Transient Response
(VREF = 2.5 V, CL = 10 μF)
GUID-3CF51E10-9559-4BD2-80FE-EEF8E7C4B9C6-low.svgFigure 7-16 Load Transient Response
(VREF = 2.5 V, CL = 1 μF)
GUID-42ED4C1F-7024-4270-9759-62BB3DB828A0-low.svgFigure 7-18 Load Transient Response
(VREF = 1.25 V, CL = 1 μF)
GUID-55295BC9-08F6-41F7-8D50-9523282AD7C1-low.svgFigure 7-20 Line Transient Response
(VREF = 1.25 V, CL = 1 μF)
GUID-20220814-SS0I-RQDH-ZDRZ-TWN4W6VMDMZJ-low.svgFigure 7-22 Power Supply Rejection Ratio
(VREF = 2.5 V, IL = 0 mA)
GUID-20230808-SS0I-CH0Q-BQM8-HNZVN2WLMJHF-low.svgFigure 7-24 Quiescent Current vs Free-Air Temperature
GUID-E572C3EE-0C67-4ED2-88B1-CCC53445145D-low.svgFigure 7-26 Solder Heat Shift Distribution