SNAS809B
December 2021 – May 2024
REF35
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Electrical Characteristics YBH package
6.7
Typical Characteristics
7
Parameter Measurement Information
7.1
Solder Heat Shift
7.2
Temperature Coefficient
7.3
Long-Term Stability
7.4
Thermal Hysteresis
7.5
Noise Performance
7.5.1
Low-Frequency (1/f) Noise
7.5.2
Broadband Noise
7.6
Power Dissipation
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Supply Voltage
8.3.2
EN Pin
8.3.3
NR Pin
8.4
Device Functional Modes
8.4.1
Basic Connections
8.4.2
Start-Up
8.4.3
Output Transient Behavior
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Negative Reference Voltage
9.2.2
Precision Power Supply and Reference
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Selection of Reference
9.2.2.2.2
Input and Output Capacitors
9.2.2.2.3
Selection of ADC
9.2.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Examples
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YBH|4
MXBG407
DBV|6
MPDS026P
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snas809b_oa
snas809b_pm
2
Applications
Flow transmitter
Blood glucose monitor
Servo drive control module
Power quality analyzer
Fault indicator
Oscilloscope
Process analytics
Optical Module