SNAS809C December   2021  – September 2024 REF35

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics YBH package
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Temperature Coefficient
    3. 7.3 Long-Term Stability
    4. 7.4 Thermal Hysteresis
    5. 7.5 Noise Performance
      1. 7.5.1 Low-Frequency (1/f) Noise
      2. 7.5.2 Broadband Noise
    6. 7.6 Power Dissipation
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 EN Pin
      3. 8.3.3 NR Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Basic Connections
      2. 8.4.2 Start-Up
      3. 8.4.3 Output Transient Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Negative Reference Voltage
      2. 9.2.2 Precision Power Supply and Reference
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Selection of Reference
          2. 9.2.2.2.2 Input and Output Capacitors
          3. 9.2.2.2.3 Selection of ADC
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • YBH|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics YBH package

At VIN = VREF + 0.5V, VEN = VIN, CREF = 10µF, CIN = 0.1µF, IL = 0mA, minimum and maximum specifications at TA = –40℃ to 125℃, typical specifications TA = 25℃; unless otherwise noted
PARAMETER TEST CONDITION MIN TYP MAX UNIT
ACCURACY AND DRIFT
Output voltage accuracy TA = 25℃ –0.05 0.05 %
Output voltage temperature coefficient –40℃ ≤ TA ≤ 85℃ 10 ppm/℃
LINE AND LOAD REGULATION
ΔVREF/ΔVIN Line regulation VREF < 2.5V; VIN = VREF + VDO to VINMAX 40 160 ppm/V
VREF ≥ 2.5V; VIN = VREF + VDO to VINMAX 40 80 ppm/V
ΔVREF/ΔIL Load regulation IL = 0mA to 10mA,
VIN = VREF + VDO		 Source 20 60 ppm/mA
IL = 0mA to 5mA,
VIN = VREF + VDO		 Sink 40 350 ppm/mA
POWER SUPPLY
VIN Input voltage (1) VREF + VDO 6 V
IQ Quiescent current Active mode TA = 25℃ 0.65 0.9 µA
–40℃ ≤ TA ≤ 85℃ 1.3
–40℃ ≤ TA ≤ 125℃ 2.6
Shutdown mode TA = 25℃ 0.1
–40℃ ≤ TA ≤ 125℃ 0.5
VEN Enable pin voltage Active mode (EN = 1 or Float) 0.7 x VIN V
Shutdown mode (EN = 0) 0.3 x VIN
IEN Enable pin current VEN = VIN 0.05 0.1 uA
VDO Dropout voltage IL = 5mA 120 mV
IL = 10mA 250
ISC Short circuit current, Sourcing VREF = 0V, TA = 25℃ 30 mA
ISC Short circuit current, Sinking VREF = VIN V, TA = 25℃ 20 mA
TURNON TIME
tON Turn-on time (2) 0.1% settling, CREF = 1µF, VREF = 2.048V 2 ms
NOISE
en Output voltage noise ƒ = 10Hz to 1kHz 0.7 ppmrms
enp-p Low frequency noise ƒ = 0.1Hz to 10Hz, VREF ≥ 2.5V 3.8 ppmp-p
ƒ = 0.1Hz to 10Hz, VREF < 2.5V 3.3 ppmp-p
HYSTERESIS AND LONG-TERM STABILITY
Long-term stability 0 to 1000h at 35°C 40 ppm
Output voltage hysteresis 25°C, –40°C, 125°C, 25°C (cycle 1) 70 ppm
STABLE CAPACITANCE RANGE
Input capacitor range 0.1 µF
Output capacitor range (3) 0.1 10 µF
(1) For VREF = 1.024V to 1.5V, minimum VIN = 1.7V.
(2) Scales linearly with VREF.
(3) ESR for the capacitor can range from 10mΩ to 400mΩ.