SBOS502F September   2009  – December 2016 REF5025-HT

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Adjustment Using the TRIM/NR Pin
      2. 7.3.2 Low Temperature Drift
      3. 7.3.3 Temperature Monitoring
      4. 7.3.4 Noise Performance
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Negative Reference Voltage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Positive Reference Voltage
        1. 8.2.2.1 Detailed Design Procedure
          1. 8.2.2.1.1 Load Capacitance
          2. 8.2.2.1.2 Bandgap Noise Reduction
    3. 8.3 System Example
      1. 8.3.1 Data Acquisition
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

HKJ Package
8-Pin CFP
Top View
REF5025-HT hkj_po_bos502.gif
DNC = Do not connect
NC = No internal connection
HKQ Package
8-Pin CFP
Top View
REF5025-HT hkq_po_bos502.gif
HKQ is a dead bug performed version of HKJ

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
DNC 1, 8 — Do not connect
GND 4 Power System ground
NC 7 — No internal connection
TEMP 3 O Temperature monitoring pin provides a temperature-dependent voltage output
TRIM/NR 5 I Output adjustment and noise reduction input. Connecting 1 μF to this pin creates a low-pass filter at the bandgap and reduce output noise
VIN 2 Power Power supply voltage. Range from VOUT + 0.2 V up to 18 V. TI recommends a bypass capacitor with a value from 1 μF up to 10 μF
VOUT 6 O Very accurate, factory-trimmed voltage output. TI recommends a bypass capacitor with a value from 1 μF up to 50 μF with ESR between 1 and 1.5 Ω

Bare Die Information

DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
15 mils Silicon with backgrind GND Al-Cu (0.5%) 598 nm
REF5025-HT die1_bos502.gif

Bond Pad Coordinates in Microns

DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
NC 1 35.45 46.55 111.45 122.55
NC 2 496.75 56.55 572.75 132.55
VIN 3 607.45 56.55 683.45 132.55
NC 4 637.9 39.4 1013.9 115.4
TEMP 5 1660.1 47.2 1736.1 123.2
GND 6 1770.9 38.85 1847.05 115
GND 7 1877.1 59.6 2016.8 135.6
TRIM/NR 8 1904.65 1553.4 1980.65 1629.4
NC 9 1782.15 1553.4 1858.15 1629.4
VOUT 10 1080.2 1559.85 1219.9 1636
VOUT 11 880.25 1543.55 956.25 1619.55
NC 12 35.45 1553.45 111.45 1629.45