SBOS456H September   2008  – February 2015 REF5020A-Q1 , REF5025A-Q1 , REF5030A-Q1 , REF5040A-Q1 , REF5045A-Q1 , REF5050A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Per Device
    6. 7.6 Electrical Characteristics: All Devices
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 Using the TRIM/NR Pin
      3. 8.3.3 Temperature Drift
      4. 8.3.4 Temperature Monitoring
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Thermal Hysteresis
    2. 9.2 Typical Applications
      1. 9.2.1 Standalone Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power Dissipation
          2. 9.2.1.2.2 Noise Performance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Negative-Reference Voltage Applications
      3. 9.2.3 Data-Acquisition Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from G Revision (October 2013) to H Revision

  • Added the Pin Configuration and Functions section, Recommended Operating Conditions table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added A-Q1 to the end of the device numbers Go
  • Changed the MIN and MAX values for the REF5040 initial accuracy parameter in the Electrical Characteristics table Go

Changes from F Revision (September 2011) to G Revision

  • Deleted reference to high grade throughout the documentGo
  • Deleted Package/Ordering Information table from datasheetGo
  • Deleted references to the MSOP-8 package and High-Grade from the THERMAL HYSTERESIS section of the ELECTRICAL CHARACTERISTICS: ALL DEVICES tableGo
  • Deleted references to the MSOP-8 package from the LONG-TERM STABILITY section of the ELECTRICAL CHARACTERISTICS: ALL DEVICES tableGo
  • Deleted graphs for MSOP-8 package from TYPICAL CHARACTERISTICS sectionGo

Changes from E Revision (August 2011) to F Revision

  • Added REF5045AQDRQ1 HBM ESD rating of 1000 VGo

Changes from D Revision (October, 2010) to E Revision