SBOS708B May   2016  – August 2016 REF6025 , REF6030 , REF6033 , REF6041 , REF6045 , REF6050

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
   1.     Device Images
      1.      Typical Application
      2.      Reference Droop comparison (1 LSB = 19.07 µV, With ADS8881 at 1 MSPS)
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Typical Characteristics
8. 8 Parameter Measurement Information
   1. 8.1 Solder Heat Shift
   2. 8.2 Thermal Hysteresis
   3. 8.3 Reference Droop Measurements
   4. 8.4 1/f Noise Performance
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Integrated ADC Drive Buffer
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Load Current
      4. 9.3.4 Stability
   4. 9.4 Device Functional Modes
10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Results
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Documentation Support
       1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
14. 14Mechanical, Packaging, and Orderable Information