SBOS708B May   2016  – August 2016 REF6025 , REF6030 , REF6033 , REF6041 , REF6045 , REF6050

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Reference Droop comparison (1 LSB = 19.07 µV, With ADS8881 at 1 MSPS)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Thermal Hysteresis
    3. 8.3 Reference Droop Measurements
    4. 8.4 1/f Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Integrated ADC Drive Buffer
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Load Current
      4. 9.3.4 Stability
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Results
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.3 Load Current

The REF6025, REF6030, REF6033 and REF6041 are specified to deliver current load of ±4 mA. The REF6045 is specified to deliver ±3.5 mA, and the REF6050 is specified to deliver ±3 mA. The REF60xx are protected from short circuits at the output by limiting the output short-circuit current.

The short-circuit current limit (ISC) of the REF60xx family of devices is adjusted by connecting a resistor (RSS) on the SS pin. The short-circuit current limit when the REF60xx device is sourcing current can be calculated as shown in Equation 4:

Equation 4. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 Eq1_BOS708.gif

The short circuit current limit when the REF60xx device is sinking is calculated as shown in Equation 5:

Equation 5. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 Eq2_BOS708.gif

The recommended output current of the REF60xx also depends on the resistor connected to the SS pin. The recommended output current (sourcing and sinking) for the REF6025, REF6030, REF6033 and REF6041 is given by Equation 6:

Equation 6. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 Eq3_BOS708.gif

The recommended output current (sourcing and sinking) for the REF6045 is given by Equation 7:

Equation 7. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 Eq4_BOS708.gif

The recommended output current (sourcing and sinking) for the REF6050 is given by Equation 8:

Equation 8. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 Eq5_BOS708.gif

The temperature of the device increases according to Equation 9:

Equation 9. REF6025 REF6030 REF6033 REF6041 REF6045 REF6050 q_pwr-diss_bos600.gif

where

  • TJ = junction temperature (°C).
  • TA = ambient temperature (°C).
  • PD = power dissipated (W).
  • RθJA = junction-to-ambient thermal resistance (°C/W).

The REF60xx maximum junction temperature must not exceed the absolute maximum rating of 150°C.