SBOS747B May 2016 – August 2016 REF6125 , REF6130 , REF6133 , REF6141 , REF6145 , REF6150
PRODUCTION DATA.
THERMAL METRIC(1) | REF61xx | UNIT | |
---|---|---|---|
DGK (VSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 158.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 51.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 79.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 5.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 78.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |