SBOS748 September   2016 REF6225 , REF6230 , REF6233 , REF6241 , REF6245 , REF6250

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Reference Droop comparison (1 LSB = 19.07 µV, With ADS8881 at 1 MSPS)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Thermal Hysteresis
    3. 8.3 Reference Droop Measurements
    4. 8.4 1/f Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Integrated ADC Drive Buffer
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Load Current
      4. 9.3.4 Stability
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Results
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Thermal Hysteresis

Thermal hysteresis for the device is defined as the change in output voltage after operating the device at 25°C, cycling the device through the specified temperature range, and returning to 25°C. Thermal hysteresis was measured with the REF62xx soldered to a PCB, similar to a real-world application. The PCB was baked at 150°C for 30 minutes before thermal hysteresis was measured. Thermal hysteresis is expressed as:

Equation 1. REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 q_hysteresis_sbos600.gif

where

  • VHYST = thermal hysteresis (in units of ppm).
  • VNOM = the specified output voltage.
  • VPRE = output voltage measured at 25°C pretemperature cycling.
  • VPOST = output voltage measured after the device has cycled from 25°C through the specified temperature range of 0°C to 70°C and returns to 25°C.

Typical thermal hysteresis distribution is shown in Figure 41 and Figure 42.

REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C028_SBOS748.pngFigure 41. Thermal Hysteresis Distribution (Cycle 1)
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C027_SBOS748.pngFigure 42. Thermal Hysteresis Distribution (Cycle 2)