SBOS748
September 2016
REF6225
,
REF6230
,
REF6233
,
REF6241
,
REF6245
,
REF6250
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Typical Application
Reference Droop comparison (1 LSB = 19.07 µV, With ADS8881 at 1 MSPS)
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Parameter Measurement Information
8.1
Solder Heat Shift
8.2
Thermal Hysteresis
8.3
Reference Droop Measurements
8.4
1/f Noise Performance
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Integrated ADC Drive Buffer
9.3.2
Temperature Drift
9.3.3
Load Current
9.3.4
Stability
9.4
Device Functional Modes
10
Applications and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Results
10.2.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.1.1
Related Documentation
13.2
Related Links
13.3
Receiving Notification of Documentation Updates
13.4
Community Resources
13.5
Trademarks
13.6
Electrostatic Discharge Caution
13.7
Glossary
14
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DGK|8
MPDS028E
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos748_oa
10.2.1
Design Requirements
Burst-mode support (see
Reference Droop Measurements
section for more details)
ENOB > 16 bits
THD < –120 dB
Power consumption < 50 mW
Throughput = 1 MSPS