SLPS785 December 2023 RES11A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The voltage coefficients of the RES11A are almost entirely related to self-heating, where the power dissipated in the device raises the die temperature. As previously mentioned, the commonality of this temperature rise leads to a comparable shift in each resistor, such that the divider ratio is well preserved.
Applying voltage V across resistor or divider R results in the loss of a corresponding power dissipation of P = V2 / R, in the form of heat in the device die. This heat leads to a localized increase in the junction temperature, which in turn causes the same parametric shifts previously discussed in the context of temperature coefficients. TCR is specified as a function of ambient temperature; therefore, use the effective junction-to-ambient thermal resistance to determine the effective temperature rise and calculate the nominal or expected shift.
The difference of the expected value of R from the actual value of R describes the actual-to-expected mismatch error of R, due to non-temperature-related effects on the voltage coefficient. Similar to the logarithmic conformity error of a logarithmic amplifier or the integrated nonlinearity error of an ADC, this error describes the deviations of the actual device behavior from the predictable behavior. While the absolute magnitude of the shift varies, the slope or trend is predictable.
The measured value of R for low bias (measured by sourcing a very small current) is used with the actual value of R to calculate the effective voltage coefficient of resistance.
This exercise is repeated for each Rx, tD1, tD2, and tM, to calculate the voltage coefficients associated with each parameter. For example, the RES11A40 has a typical absolute voltage coefficient of approximately 0.02 Ω/V for RIN or RG. When considered in ratiometric terms, the typical voltage coefficient of tD1 or tD2 is 2 ppm/V, and the voltage coefficient of tM is 0.5 ppm/V.