SLVS077F April   1977  – January 2021 SG2524 , SG3524

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7 12
    1. 7.1 Electrical Characteristics
    2. 7.2 Electrical Characteristics — Continued, Both Parts
    3. 7.3 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 17
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Blanking
      2. 9.3.2 Error Amplifier
      3. 9.3.3 Compensation
      4. 9.3.4 Output Circuitry
      5. 9.3.5 Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Synchronous Operation
      2. 9.4.2 Shutdown Circuitry
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.3 Compensation Components

External compensation components for stability should also be placed close to the IC. Surface mount components are recommended here as well for the same reasons discussed for the filter capacitors. These should not be located very close to the inductor either.