SLVS077F April   1977  – January 2021 SG2524 , SG3524

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7 12
    1. 7.1 Electrical Characteristics
    2. 7.2 Electrical Characteristics — Continued, Both Parts
    3. 7.3 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 17
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Blanking
      2. 9.3.2 Error Amplifier
      3. 9.3.3 Compensation
      4. 9.3.4 Output Circuitry
      5. 9.3.5 Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Synchronous Operation
      2. 9.4.2 Shutdown Circuitry
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2 Input/Output Capacitors

When using a low value ceramic input filter capacitor, it should be located as close to the VIN pin of the IC as possible. This will eliminate as much trace inductance effects as possible and give the internal IC rail a cleaner voltage supply. Some designs require the use of a feed-forward capacitor connected from the output to the feedback pin as well, usually for stability reasons. In this case it should also be positioned as close to the IC as possible. Using surface mount capacitors also reduces lead length and lessens the chance of noise coupling into the effective antenna created by through-hole components.