SLVS077F April   1977  – January 2021 SG2524 , SG3524

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7 12
    1. 7.1 Electrical Characteristics
    2. 7.2 Electrical Characteristics — Continued, Both Parts
    3. 7.3 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 17
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Blanking
      2. 9.3.2 Error Amplifier
      3. 9.3.3 Compensation
      4. 9.3.4 Output Circuitry
      5. 9.3.5 Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Synchronous Operation
      2. 9.4.2 Shutdown Circuitry
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)1000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.