SNOSBA2B July   2011  – May 2015 SM74101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Detailed Operating Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inverting Mode of Operation
      2. 7.4.2 Non-inverting Mode of Operation
    5. 7.5 Thermal Considerations
      1. 7.5.1 Drive Power Requirement Calculations In SM74101
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

WSON
6-Pin
Top View
SM74101 30159902.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
IN 1 I TTL compatible thresholds. Pull up to VCC when not used.
VEE 2 - Connect to either power ground or a negative gate drive supply for positive or negative voltage swing.
VCC 3 I Locally decouple to VEE. The decoupling capacitor should be located close to the chip.
OUT 4 O Capable of sourcing 3A and sinking 7A. Voltage swing of this output is from VEE to VCC.
IN_REF 5 - Connect to power ground (VEE) for standard positive only output voltage swing. Connect to system logic ground when VEE is connected to a negative gate drive supply.
INB 6 I TTL compatible thresholds. Connect to IN_REF when not used.
- - - Exposed Pad - Internally bonded to the die substrate. Connect to VEE ground pin for low thermal impedance.