SNOSBA3D June   2011  – May 2015 SM74104

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Typical Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Typical Performance Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Setting the Delay Timer with RT
    4. 6.4 Device Functional Modes
      1. 6.4.1 Startup and UVLO
    5. 6.5 Power Dissipation Considerations
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Trademarks
    2. 10.2 Electrostatic Discharge Caution
    3. 10.3 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

8-Pin SOIC
Package D
Top View
SM74104 30160001.gif
10-Pin WSON
Package DPR
Top View
SM74104 30160002.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
D DPR
VDD 1 1 I Positive supply voltage input.
HB 2 2 I Positive connection for high-side bootstrap capacitor.
HO 3 3 O High-side output to drive the top MOSFET.
HS 4 4 I Switch node pin.
RT 5 7 I Delay timer pin. The additional delay of the timer prevents lower and upper MOSFETs from conducting simultaneously, thereby preventing shoot-through. Timer delay is set with a resistor to ground.
IN 6 8 I PWM control input for LO and HO outputs.
VSS 7 9 - Ground pin.
LO 8 10 O Low-side output to drive the bottom MOSFET.
N/C - 5, 6 - No connect.
Exposed Pad - Exposed Pad - The exposed die attach pad (DAP) on the 10-pin WSON package functions as a thermal connection and can be soldered to a copper plane under the device. The DAP nas no direct electrical connection to any of the pins. It can be left floating, but it is recommended to connect this to VSS.