SCDS411D July   2019  – October 2022 SN3257-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8.     Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Timing Requirements

VDD = 1.5 V to 5.5 V, GND = 0V, TA = –40°C to +125°C
Typical values are at VDD = 3.3 V, TA = 25°C, (unless otherwise noted)
PARAMETERTEST CONDITIONSMINNOMMAXUNIT
tTRANTransition time from control input VDD = 2.5 V to 5.5 V
VS = VDD
RL = 200 Ω, CL = 15 pF
Refer to Transition Timing Figure		160350ns
tTRANTransition time from control input VDD < 2.5 V
VS = VDD
RL = 200 Ω, CL = 15 pF
Refer to Transition Timing Figure		180580ns
tON(EN)Device turn on time from enable pinVS = VDD
RL = 200 Ω, CL = 15 pF
Refer to Ton(EN) and Toff(EN) Figure		1235µs
tOFF(EN)Device turn off time from enable pinVS = VDD
RL = 200 Ω, CL = 15 pF
Refer to Ton(EN) and Toff(EN) Figure		5095ns
tON(VDD)Device turn on time (VDD to output)VS = 3.6 V
VDD rise time = 1 µs
RL = 200 Ω, CL = 15 pF
Refer to Ton(vdd) and Toff(vdd) Figure		2060µs
tOFF(VDD)Device turn off time (VDD to output)VS = 3.6 V
VDD fall time = 1 µs
RL = 200 Ω, CL = 15 pF
Refer to Ton(vdd) and Toff(vdd) Figure		1.22.7µs
tOPEN (BBM)Break before make timeVS = 1 V
RL = 200 Ω, CL = 15 pF
Refer to Topen(BBM) Figure		0.5ns
tSK(P)Inter-channel skew – SOT-23 (DYY)Refer to Tsk Figure10ps
tSK(P)Inter-channel skew – TSSOP (PW)Refer to Tsk Figure18ps
tPDPropagation delay – SOT-23 (DYY)Refer to Tpd Figure78ps
tPDPropagation delay – TSSOP (PW)Refer to Tpd Figure95ps