SCAS519G July   1995  – July 2024 SN54AC04 , SN74AC04

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device and Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN54AC04 SN74AC04 SN54AC04 J or W Package; SN74AC04 D, DB, N, NS, or PW Package; 14-Pin CDIP, CFP, SOIC, SSOP, PDIP, SOP, and TSSOP (Top View)Figure 4-1 SN54AC04 J or W Package; SN74AC04 D, DB, N, NS, or PW Package; 14-Pin CDIP, CFP, SOIC, SSOP, PDIP, SOP, and TSSOP (Top View)
SN54AC04 SN74AC04 SN54AC04 FK Package, 20-Pin LCCC (Top View)Figure 4-3 SN54AC04 FK Package, 20-Pin LCCC (Top View)
SN54AC04 SN74AC04 SN74AC04 BQA Package, 14-Pin WQFN (Top View)Figure 4-2 SN74AC04 BQA Package, 14-Pin WQFN (Top View)
PIN I/O DESCRIPTION
NAME D, DB, N, NS, PW, J, W, or BQA FK
1A 1 2 Input Channel 1, Input A
1Y 2 3 Output Channel 1, Output Y
2A 3 4 Input Channel 2, Input A
2Y 4 6 Output Channel 2, Output Y
3A 5 8 Input Channel 3, Input A
3Y 6 9 Output Channel 3, Output Y
GND 7 10 — Ground
4Y 8 12 Output Channel 4, Output Y
4A 9 13 Input Channel 4, Input A
5Y 10 14 Output Channel 5, Output Y
5A 11 16 Input Channel 5, Input A
6Y 12 18 Output Channel 6, Output Y
6A 13 19 Input Channel 6, Input A
VCC 14 20 — Positive Supply
NC 1, 5, 7, 11, 15, 17 — Not internally connected
Thermal Pad(1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) BQA package only.