SCAS517G June   1995  – March 2024 SN54ACT244 , SN74ACT244

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SNx4ACT244 UNIT
DB
(SSOP)		 DGS
(VSSOP)		 DW
(SOIC)		 N
(PDIP)		 NS
(SO)		 PW
(TSSOP)		 RKS
(VQFN)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 117.2 123.5 101.2 48.1 106.2 126.2 67.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.9 62.1 68.2 34.1 72 68.7 72.4 °C/W
RθJB Junction-to-board thermal resistance 72.1 78.5 69.7 29 71.2 77.3 40.4 °C/W
ψJT Junction-to-top characterization parameter 43.1 7.8 44.1 19.5 42.4 22.3 10.3 °C/W
ψJB Junction-to-board characterization parameter 71.7 78.0 69.2 28.9 70.9 76.9 40.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A 24.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.