SCLS258N December   1995  – July 2024 SN54AHC138 , SN74AHC138

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics: VCC = 3.3V ± 0.3V
    6. 4.6 Switching Characteristics: VCC = 5V ± 0.5V
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Function Table
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

SN54AHC138 SN74AHC138 D, DB, DGV , N, NS , or PW Package, 16-Pin SOIC, SSOP, TVSOP, PDIP, SOP, or TSSOP(Top View)Figure 3-1 D, DB, DGV , N, NS , or PW Package, 16-Pin SOIC, SSOP, TVSOP, PDIP, SOP, or TSSOP
(Top View)
SN54AHC138 SN74AHC138 RGY Package,16-Pin VQFN (Top View)Figure 3-2 RGY Package,
16-Pin VQFN
(Top View)
SN54AHC138 SN74AHC138 FK Package,20-Pin LCCC(Top View)
NC: No internal connection
Figure 3-3 FK Package,
20-Pin LCCC
(Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A0 1 I Address select 0
A1 2 I Address select 1
A2 3 I Address select 2
G0 4 I Output strobe 0, active low
G1 5 I Output strobe 1, active low
G2 6 I Output strobe 2
Y7 7 O Output 7
GND 8 G Ground
Y6 9 O Output 6
Y5 10 O Output 5
Y4 11 O Output 4
Y3 12 O Output 3
Y2 13 O Output 2
Y1 14 O Output 1
Y0 15 O Output 0
VCC 16 P Positive supply
Thermal pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
(2) WBQB package only.