SCLS226 Data sheet

SCLS226L October 1995 – July 2024 SN54AHC244 , SN74AHC244

PRODUCTION DATA

Refer to the PDF data sheet for device specific package drawings

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT244						UNIT
		DB	DGV	DW	N	NS	PW
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	99.9	119.2	81.1	54.9	77.6	116.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	61.7	34.5	48.9	41.7	42.7	58.5
R_θJB	Junction-to-board thermal resistance	55.2	60.7	53.8	35.8	45.7	78.7
ψ_JT	Junction-to-top characterization parameter	22.6	1.2	19.5	27.9	10.2	12.6
ψ_JB	Junction-to-board characterization parameter	54.8	60.0	53.1	35.7	45.2	77.9
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	N/A	n/a	N/A	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.