SCLS260N December   1995  – July 2024 SN54AHC540 , SN74AHC540

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7  Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Layout Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AHC540UNIT
DB (SSOP)DGV (TVSOP)DW
(SOIC)		N
(PDIP)		NS
(PDIP)		PW (TSSOP)
20 PINS20 PINS20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance99.9119.281.154.980.4116.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance61.734.548.941.746.958.5°C/W
RθJBJunction-to-board thermal resistance55.260.753.835.847.978.7°C/W
ψJTJunction-to-top characterization parameter22.61.219.527.919.912.6°C/W
ψJBJunction-to-board characterization parameter54.860.053.135.747.577.9°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).