SCLS264R December   1995  – February 2024 SN54AHCT125 , SN74AHCT125

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions #GUID-C584B3C3-85AF-4F58-8781-0C1F02DBE148/SCLS2644195
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Noise Characteristics
    7. 5.7 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Recommended Operating Conditions(1)

SN54AHCT125SN74AHCT125UNIT
MINMAXMINMAX
VCCSupply voltage4.55.54.55.5V
VIHHigh-level input voltage22V
VILLow-level input voltage0.80.8V
VIInput voltage05.505.5V
VOOutput voltage0VCC0VCCV
IOHHigh-level output current–8–8mA
IOLLow-level output current88mA
Δt/ΔvInput transition rise or fall rate2020ns/V
TAOperating free-air temperature–55125–4085°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.