SCLS266O December   1995  – July 2024 SN54AHCT138 , SN74AHCT138

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
    8. 4.8 Typical Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74AHCT138 UNIT
DGV (TVSOP) D (SOIC) DB (SSOP) N (PDIP) NS (SOP) PW (TSSOP) RGY (VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 120 93.8 82 67 64 135.9 39 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.