SCLS246T October   1995  – October 2023 SN54AHCT14 , SN74AHCT14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74AHCT14UNIT
DDGVDBNNSPWRGYBQA
14 PINS
RθJAJunction-to-ambient thermal resistance124.5138.7113.161.198.6147.763.788.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance78.860.665.648.054.177.477.6

90.9

RθJBJunction-to-board thermal resistance8171.860.441.057.490.939.7

56.8

ψJTJunction-to-top characterization parameter3710.625.532.419.627.25.7

9.9

ψJBJunction-to-board characterization parameter80.671.159.940.957.090.239.9

56.7

RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A19.9

33.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).